Gigabyte B760m Gaming X DDR4
- Intel® Socket LGA 1700: Supports 13th and 12th generation series processors
- Unparalleled performance : Digital VRM Solution Hybrid 8+1+1 phases
- Management of the XMP Double Canal DDR4 memory module: 4 * DIMM
- New generation storage: 2 PCIE connectors 4.0 x4 m.2
- Advanced thermal design and M.2 thermal protection: to guarantee the stability of the VRM power and the performance of the SSD M.2
- EZ-LATCH: PCIE 4.0x16 location with quick clearance design
- Rapid networks: LAN 2.5 GBE
- Extended connectivity : front USB-C® 10GB/S, DP, HDMI
- Smart Fan 6: has several temperature sensors, hybrid fan heads with fan stop.
- Q-Flash Plus : Update the BIOS without installing the processor, memory and graphics card
Processor |
Socket LGA1700: Support for Intel® Core ™, Pentium® Gold and Celeron® processors from 13th and 12th generation The L3 cache varies according to the processor |
Chipset | Intel® B760 Express Chipset |
Memory | Support for DDR4 5333 (O.C.)/ 5133 (O.C.)/ 5000 (O.C.)/ 4933 (O.C.)/ 4800 (O.C.)/ 4700 (O.C.)/ 4600 (O.C.)/ 4500 (O.C.)/ 4400 (O.C.)/ 4300 (O.C.)/ 4266 (O.C.)/ 4133 (O.C.)/ 4000 (O.C.)/ 3866 (O.C.)/ 3800 (O.C.)/ 3733 (O.C.)/ 3666 (O.C.)/ 3600 (O.C.)/ 3466 (O.C.)/ 3400 (O.C.)/ 3333 (O.C.)/ 3300 (O.C.)/ 3200/ 3000/2933/2666/2400/2133 MT/ S Modules of memory modules 4 DDR DDM connectors supported up to 128 GB (32 GB unique DIMM capacity) of system memory Double channel memory architecture Management of ECC Un-Buffered DIMM 1RX8/2RX8 memory modules (operate in non-ECC mode) Management of non-ECC memory modules UN-BUFFERED DIMM 1RX8/2RX8/1RX16 Management of Extreme Memory Profile memory modules (XMP) |
Integrated graphics card | Integrated Graphics Processor-Intel® HD Graphics Support:
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Audio |
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Network | Realtek® 2.5GBe LAN CHIP (2.5 GBPS/1 Gbps/100 Mbps) |
Expansion | CPU:
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Storage interface | CPU:
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USB |
Chipset:
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Internal input/output connectors |
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Connecteur du Panneau Arrière |
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BIOS |
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Dimensions | mATX Form Factor; 24.4cm x 24.4cm |